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| Datasheet File OCR Text: |
| Point of note about solderability of lead free products (attach "G" to package name) Test parameter Solderability Use of Sn-63Pb solder Bath Solder bath temperature = 230C, Dipping time = 5 seconds The number of times = one, Use of R-type flux Use of Sn-3.0Ag-0.5Cu solder bath Solder bath temperature =245C, Dipping time = 5 seconds The number of times = one, Use of R-type flux (use of lead free) Pass: solderability rate until forming 95% Test condition Note |
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